摘要
研究了无铅钎料合金Sn3.8Ag0.7Cu高温时效过程中显微组织,特别是金属间化合物(IMC)的演化规律,以及稀土Y的添加对其产生的影响。结果表明:在高温时效过程中合金内部组元发生扩散与重组,伴随着共晶组织的逐渐溶解,新的IMC在组织内部呈球形弥散析出。结晶初期形成的具有规则形状的较粗大的IMC逐渐发生解体,树枝状富Sn相逐渐取代共晶组织成为受腐蚀的对象。随着时效时间的延长,合金内部各组元的成分也在不断发生变化。
The evolution of microstructure especially the IMC at high temperature aging process had been systematically investigated and the effect of trace amount rare earth Y also had been studied. The results show that diffusion and reassemble occur in the constituent phase of solder alloy during aging process. At the same time, new formed IMC in the form of sphere is dispersedly separated out accompanied with the dissolution of eutectic phase. Thick IMC, which was produced at initial crystalline stage and uniform in the form, is gradually disorganizing. Arborous β-Sn is eroded in place of eutectic phase and composition of the constituent phases is continuously changing with the aging time.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2006年第2期52-54,共3页
Electronic Components And Materials
基金
国家863高技术资助项目(No.2002AA322040)
