摘要
贮藏几年的低分子聚酰胺作为室温固化剂和环氧成浇灌绝缘材料，发现固化产物的抗剪、耐水性降低、测量发现其胺值下降，经红外光谱分析，用它和环氧固化。
low molecule polyamide,which has been stored about 12 years was used to cured epoxy resin as filling compounds. Its shear strength,water resistance were decreased,its number of amine bases decreased too. y using IR,the left epoxy bases cured by the polyamide much more than that do by new one coming form factory recently. At 990cm -1 peak value of amine bases differ much each other.
出处
《化学与粘合》
CAS
1996年第3期157-159,共3页
Chemistry and Adhesion
关键词
聚酰胺
贮藏
固化性能
环氧树脂
low molecule polyamide storage
time
cured material character
