新型低温固化双马来酰亚胺树脂基体研究

Study on A New Bismaleimids MatrixCured at Low Temperature

双马来酸亚胶树脂基体耐热性好，具有优异的使用性能；但固化温度往往高于２００℃。引发剂可有效地降低固化温度，但所得树脂基体脆性很大。本文在二元胺扩链、烯丙基双酚Ａ共聚后的双马来酰亚胺树脂锄中加入引发剂，制得一种软化点低、韧性适中、耐热性好、贮存稳定的低温固化双马来酰亚胺树脂ＢＤＤＤ体系。为今后该树脂在复合材料构件上的应用奠定了良好的基础。

The curing temperature of bismaleimide resins is known to be higher than 200℃,althoughtheir heat resistance many other properties are excellent. An initiator can reduce the temperature,but the resin added it is rather brittle. A new type of bismaleimide resins called BDDD system hasbeen abtained by the methods of diamine extending chain and diallyl bisphenol A copolymerizing.A matrix cured at low temperature has been prepared by an iniator from the new resin. This matrix has been detected to have the properties of low softing point, middle toughness, execellentheat resistance and good storage stabilities. The work bas laid a good foundation for manufacturing of the composite frameworks.