摘要
采用机械活化制粉、低温烧结和致密化处理,制取了不同Ni含量的Mo-Cu合金。研究了Ni对Mo-Cu合金的致密性、膨胀系数、导热和导电性能的影响。结果表明,添加活化元素Ni使Mo-Cu合金的烧结致密化温度降低,热膨胀系数的变化与Al2O3陶瓷的变化很吻合,导电和导热性能降低,显微组织细小均匀,成为网络结构,是一种与Al2O3陶瓷封接匹配得很好的电子封接材料。
The Mo-Cu alloys with different mass percentage Ni were prepared by MA powder,sintefing at low temperature,and hot working. The influence of Ni on the density, expansion coefficient, heat and speeific conductivity of the Mo-Cu alloys was studied. The results show that the additive Ni causes in falling densification temperature,consistent change of expansion coefficient between Mo-Cu alloy and ceramics A1203,reducing conductivity, fining and homogenizing microstructurc, and forming net structure for the Mo-Cu alloy. The Mo-Cu alloy is a good compatible sealing material with ceramics Al2O3.
出处
《稀有金属快报》
CSCD
2006年第1期29-32,共4页
Rare Metals Letters
