焊膏用免清洗助焊剂的制备与研究

Preparation and Study of No-clean Flux Used for Making Solder Paste

根据免清洗助焊剂各组份的特点,分别对其活性剂、溶剂、成膜剂以及添加物进行筛选和处理。在一定温度下对各组份进行均匀化处理并制备出助焊剂,依据标准对所制备的焊剂进行性能测试。以自制的锡银铜系焊粉为基础制备焊膏并做焊接模拟。结果表明:采用有机酸和有机胺复配制备的活性物质满足预期要求;复配溶剂满足沸点、黏度和极性基团三大原则;所制备的免清洗焊剂多项性能满足规范要求,达到了免清洗的要求,解决了助焊性与腐蚀性的矛盾;所制备的焊膏焊接性能良好,无腐蚀,固体残留量低,存储寿命较长。

According to the property of the compositions in No -clean soldering flux, select activator, solvent, film former and accessories individually. Homogenizing each group at certain temperature to make flux and test the properties of the flux according to the standard. Take the powder of tin, silver and copper solder as the basis to make solder paste and simulate soldering. The result shows that the activator which was made up of organic acid and organic amine complex satisfied the prospective demand. The compound solvent met the three demands of boiling point, viscosity and polarity group. The diversified properties of the no - clean soldering flux met the standard requirements, actualized the demand of no - clean and solved the problem between solderability and causticity. The properties of the solder paste is fine, no corrosion,low solid and it can be stored for a long time.