摘要
随着BGA封装的发展和广泛应用,其将成为高密度、高性能、多功能封装的最佳选择。由于BGA特殊的封装形式,焊点位于封装体底部,需要专门的返修设备进行返修。以PBGA和CBGA为例,结合实际返修过程中的经验,对返修过程中应注意的问题进行分析,以提高BGA的返修质量。
Along with BGA package development and applying widely, it is believed that BGA will be the best choice of high density, high performance and multiple functional package style. As the solder joints are under the BGA body,it is needed special BGA rework system to rework. BGA rework process is analyzed by PBGA and CBGA practical rework process to rapid BGA rework quality.
出处
《电子工艺技术》
2006年第1期19-21,25,共4页
Electronics Process Technology
关键词
BGA
返修
温度曲线
变形
开路
短路
BGA
Rework
Temperature profile
Warpage
Open circuit
Short circuit
