片式元件自动编带工艺

Automatic Tape Technology of Chip Component

介绍了片式元件自动编带的工艺,对其中的关键工艺过程上料排队,元件放入,载带烫封和收带控制等作了详细描述,对每种工艺都提出几种实现方法,并阐述了每种方法的适用范围。

Introduce the technology of the automatic tape of chip component, explain key technology, including queue, chip placement, carries tape seal, reel control in detail, for each kind of technology, have put some kinds of realization methods, and have elaborated the suitable scope of each kind of method.