摘要
提出采用脉冲电镀在无氰亚硫酸盐体系中制备镀金层并应用在空腔靶上。讨论了电流密度、pH、温度及脉冲占空比对电镀过程及镀层性能的影响。结果发现，当占空比在1：（9～18）时，镀层最细致、光滑，粗糙度在30mm左右。采用原子力显微镜观测了该工艺处理后的空腔的形貌。由此工艺获得的金腔结构稳定，均匀致密，精度良好且外观光亮。
Gold deposit was prepared with a process of noncyanide gold pulse electroplating in sulfite system, which is applicable to cavum target. The influences of current density, pH, temperature and pulse duty ratio on electroplating process and deposit performance were discussed. The results show that the gold deposit has the finest and smoothest surface and 30 nm of roughness as pulse duty ratio is 1 ： （9 - 18 ）. The morphology of cavum target treated with the process was observed with AFM, which reveals that the gold cavity obtained by the process is stable, uniform, dense, bright and has good precision.
出处
《电镀与涂饰》
CAS
CSCD
2006年第2期39-40,45,共3页
Electroplating & Finishing
基金
国家863-804主题基金资助
关键词
惯性约束聚变
空腔靶
无氰
脉冲电镀
镀金
占空比
原子力显微镜
金腔
Inertial confinement fusion （ ICF ）
eavum target
non-cyanide
pulse eleetroplating
gold eleetroplating
duty ratio
AFM
gold cavity
