摘要
Many disadvantages exist in the traditional die design method which belongs to serial pattern. It is well known that heat treatment is highly important to the dies. A new idea of concurrent design for heat treatment process of die and mould was developed in order to overcome the existent shortcomings of heat treatment process. Heat treatment CAD/CAE was integrated with concurrent circumstance and the relevant model was built. These investigations can remarkably improve efficiency, reduce cost and ensure quality of R and D for products.
Many disadvantages exist in the traditional die design method which belongs to serial pattern. It is well known that heat treatment is highly important to the dies. A new idea of concurrent design for heat treatment process of die and mould was developed in order to overcome the existent shortcomings of heat treatment process. Heat treatment CAD/CAE was integrated with concurrent circumstance and the relevant model was built. These investigations can remarkably improve efficiency, reduce cost and ensure quality of R and D for products.
基金
ItemSponsored by National Natural Science Foundation of China (50075053)
Science and Technology Foundation ofShanghai Higher Education (03 HZ01)