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TiC金属陶瓷/钢钎焊接头的界面结构和连接强度 被引量:9

Interface structure and bonding strength of brazed joint of TiC cermet/steel
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摘要 采用BAg45CuZn钎料对自蔓延高温合成的TiC金属陶瓷与中碳钢进行了真空钎焊连接,利用扫描电镜、电子探针、X射线衍射等分析手段对接头的界面结构和室温抗剪强度进行了研究。结果表明,利用BAg45CuZn钎料可实现TiC金属陶瓷与中碳钢的连接;接头的界面结构为TiC金属陶瓷/(Cu,N i)固溶体/Ag基固溶体+Cu基固溶体/(Cu,N i)固溶体/(Cu,N i)+(Fe,N i)/中碳钢;在连接温度为850℃保温10 m in的钎焊条件下,接头的抗剪强度可达121 MPa。 The vacuum brazing of TiC cermet(synthesized by SHS) to medium carbon steel was carried out with BAg45CuZn brazing filler metal,and the interface structure and shear strength of the joints were also investigated by means of SEM,EPMA and XRD.The experimental results showed that the bonding of TiC cermet to medium steel can be performed with BAg45CuZn filler metal.The interface structure of the joint is TiC cermet/(Cu,Ni)/Ag(s,s)+Cu(s,s)/(Cu,Ni)/(Cu,Ni)+(Fe,Ni)/medium carbon steel.The maximum shear strength of the joint brazed at 850℃ for 10min is up to 121MPa at room temperature.
出处 《焊接学报》 EI CAS CSCD 北大核心 2006年第1期5-8,共4页 Transactions of The China Welding Institution
基金 国家自然科学基金资助项目(50325517)
关键词 TiC金属陶瓷 真空钎焊 界面结构 连接强度 TiC cermet steel vacuum brazing interface structure bonding strength
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参考文献11

  • 1吴爱萍 任家烈.复合陶瓷挺柱钎焊连接的研究[A]..第八次全国焊接会议论文集[C].北京:机械工业出版社,1997.346-348.
  • 2刘会杰,冯吉才.陶瓷与金属的连接方法及应用[J].焊接,1999(6):5-9. 被引量:26
  • 3Matsuo Y,Ito M,Tanignch M.Ceramic-metal joining for automobiles[J].Industrial Ceramics,1999,19(3):203-207.
  • 4Durov A V,Kostjuk B D,Shevchenko A V,et al.Joining of zirconia to metal with Cu-Ga-Ti and Cu-Sn-Pb-Ti fillers[J].Materials Science and Engineering,2000,290A(1-2):186-189.
  • 5Lugscheider E,Tillmann W.Methods for brazing ceramic andmetal-ceramic joints[J].Materials and Manufacturing Processes,1993,8(2):219-238.
  • 6Bucklow I A.Development of a brazed ceramic-faced steel tappet[J].The TWI Journal,1995,4(2):260-308.
  • 7Peteves S D.Joining nitride ceramics[J].Ceramics International,1996,22(6):527-533.
  • 8张春雷,施克仁,郭义.压力钎焊改善Si_3N_4/40Cr钢接头强度的试验研究[J].中国有色金属学报,1999,9(2):283-289. 被引量:3
  • 9Kliauga A M,Travessa D,Ferrante M.Al2O3/Ti interlayer/AISI 304 diffusion bonded joint microstructural characterization of the two interfaces[J].Materials Characterization,2001,46(1):65-74.
  • 10Travessa D,Ferrante M,Den O G.Diffusion bonding of aluminium oxide to stainless steel using stress relief interlayers[J].Materials Science and Engineering,2002,337A(1-2):287-296.

二级参考文献5

  • 1Chui You,Trans JWRI,1993年,22卷,1期,121页
  • 2Zhou Y,Mater Sci Tech,1991年,17卷,9期,863页
  • 3冼爱平,博士学位论文,1991年,202页
  • 4刘联宝,陶瓷金属封接技术指南,1990年
  • 5冼爱平,斯重遥.Sialon陶瓷与40Cr钢连接中缓冲层的作用[J].金属学报,1991,27(6). 被引量:10

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