摘要
研究了Bi、Ag对Sn-9Zn无铅钎料系统润湿性、接头力学性能及微观组织的影响。结果表明:Sn-9Zn无铅钎料的润湿性较差,添加适量的Bi有助于提高钎料的润湿性和接头剪切强度,但同时也使接头的塑性降低;添加适量的Ag能明显改善钎料的润湿性和接头塑性,但Ag的质量分数超过1.5%时会降低钎料润湿性和接头剪切强度。Sn-9Zn-Bi系无铅钎料组织由富Sn相、富Zn相及Bi的析出物组成;Sn-9Zn-Ag系无铅钎料组织由富Sn相、富Zn相及AgZn3化合物组成。
The influences of the addition of Bi, Ag to Sn-9Zn lead-free solder on the mierostrueture, wettability and mechanical properties were studied. The results show that Sn-gZn lead-free solder has poor wettability, With the addition of Bi to Sn-gZn lead-free solder, the improvement of wettability and shearing strength of joint can be achieved, but plasticity of joint decreases. With the addition of suitable amount Ag to Sn-9Zn lead-free solder, the improvement of wettability and plasticity of joint can be achieved obviously. With the addition of up to 1.5% Ag （mass fraction） to Sn-9Zn lead-free solder, the wettability and shearing strength of joint decreases. The microstructures of Sn-9Zn-Bi solder system are composed of β-Sn matrix, Zn-rieh phase and the precipitation of Bi phase in the β-Sn matrix. The mierostructures of Sn-gZn-Ag solder system are composed of β-Sn matrix, Zn-rich phase and AgZn3 intermetallie compound.
出处
《中国有色金属学报》
EI
CAS
CSCD
北大核心
2006年第1期158-163,共6页
The Chinese Journal of Nonferrous Metals
基金
吉林大学创新基金资助项目(2002CX)
