摘要
本文报导了半导体激光退火在国内外的进展概况,作为离于注入半导体生产工艺的“伴星”,激光退火有可能取代常规的高温退火工艺而被采用。
Progress in laser annealing of semiconductor both in this country and abroad are reported. It is possible that laser annealing, as an auxiliary means in the production of ion-implanted semiconductors, will be employed to replace the conventional high temperature annealing.
出处
《四川激光》
1983年第2期123-125,共3页
Laser Journal