高功率二极管激光器模块式微通道冷却器研制

Micro-channel heatsink module for high power diode laser

针对高功率二极管激光器（DL）的散热需求．对不同结构的微通道冷却器进行了模拟散热计算．优化了冷却器的结构参数。冷却器采用Cu-WCu合金复合结构，由多层金属片焊接而成，其内部散热片采用具有高热导率的无氧铜制作，上、下表面采用硬度高，热导率也较高的WCu合金制作。这种结构不仅避免了无氧铜较软、面形和棱边质量难控制的缺点，还可提高冷却器的强度．使冷却器可以做得较薄。冷却器外形尺寸为25．0mm×12．0min×1．5mm。使用连续二极管激光器板条和模拟热源对不同内部结构的微通道冷却器的热阻进行了实验测量．冷却器的热阻为0．4～0．8K／W。研制的模块式微通道冷却器可满足连续50w或脉冲功率120W（20％占空比）的高功率二极管激光器板条的散热需求．堆叠的二维叠阵DL可以很好地用作高平均功率DPL的泵浦源。

Structural parameter of micro-channel heatsink is optimized through numerical calculation. Heat resistances of 4 different structural micro-channel heatsinks are measured by experiment. In order to take advantage of copper＇s high thermal conductivity, and W-Cu alloy＇s high hardness, micro-channel heatsink module is made by compound Cu-WCu layers. With an exterior size of 25.0 mm×12.0 mm×1.5 mm and heat resistance of 0.4-0.8 K/W, the optimized micro-channel heatsink module can match the need of thermal spread for high power diode laser with pulse power 120 W（duty cycle 20 %） or continual power 50W, and can be used to package two-dimension high cycle duty or continual diode laser.