TFT-LCD切割裂片工艺参数探讨

Parameters of Cutting and Splitting Glass Substrates Process of TFT-LCD

研究了TFT—LCD切割裂片的原理，以及刀轮角度、切割压力、下压量等工艺参数对切割质量的影响。采用120°和130°两种不同角度的刀轮在切割速度300mm／s、刀轮下压量0．14mm的条件下进行切割，发现120°刀轮的切割深度比130°刀轮的要大5～10μm；当切割压力一定时，切割深度随下压量的增加而增加。在同样条件下，120°刀轮在切割压力为0．18MPa时出现横向微裂纹，130°刀轮在0．28MPa的切割压力下出现横向裂纹；可见刀轮角度越小，越容易出现横向裂纹。实验结果表明，压力是影响横向微裂纹产生的主要因素，而刀轮下压量对横向裂纹的产生没有太大影响。

The principle of cutting and splitting glass substrates of TFT LCD and the impacts of craft parameters on cutting quality, such as scribe-wheel angle, cut pressure, press amount are studied in this paper. When scribe-wheel velocity is 300 mm/s, and press amount is 0. 14 mm, the 120 °and 130 ° scribe-wheels are used to cut glass substrates, the result is that cut depth of the 120 °scribe-wheel is 5～10μm deeper than that of the 130 ° scribe wheel. When cut pressure is determined, cut depth is deeper as press amount becomes larger. Cut pressure is a main factor which results in lateral crack＇s appearance. Under the same condition, for the 120 ° scribe-wheel, the lateral crack appears at the 0.18 MPa cut pressure; for the 130 °scribe-wheel, it appears at the 0.28 MPa cut pressure. That is, the smaller scribe-wheel angle is, the easier lateral crack is to appear. Press amount has little effect onlateral crack.