摘要
研究了在化学镀镍溶液中加入碳化硅微粒的化学镀工艺,采用正交实验方法考查了沉积过程中各因素对复合镀层及镀液稳定性的影响,并对镀层的结构及表面形貌进行了分析。
Silicon carbide particles occluded Ni-P deposit was prepared from the electroless nickel plating bath containing the particles. Properties of the deposit and stability of the bath were discussed by way of orthogonal experiments. Size and quantity of SiC particle added have a significant effect upon the bath and the deposit.Structure and surface morphology of the deposit were also analysed.
出处
《电镀与精饰》
CAS
1996年第1期4-7,共4页
Plating & Finishing