摘要
随着2006年7月1日RoHS法令实施的最后期限的来临,无铅焊料的研究与应用又掀起了新一轮的热潮。由于封装材料与封装工艺的改变,给焊点可靠性带来了一系列相关问题。笔者就近年来国内外开发的无铅焊料、焊点的失效模式、焊点可靠性评价方法和焊点的主要缺陷进行了综述;对今后该领域的研究前景及方向进行了展望。
As RoHS law will be implemented on July 1,2006, the research and application of lead-free solders become a hot problem in the world. With the change of material and technics in electronic packaging, it brings the problem of solder joint reliability. Research progress of lead-free solder, invalidation models of solder joint, solder joint reliability evaluation and the defects of solder joints in recent years have been reviewed. The prospective research on directions of lead-free technology in the future are forecasted.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2006年第3期5-8,共4页
Electronic Components And Materials
基金
国防科工委基金资助项目(MPKT-04-237)
南京工业大学引进人才科研启动基金资助项目(51303021)
关键词
金属材料
无铅焊料
焊点可靠性
综述
焊点缺陷
电子封装
metal materials
lead-free solder
solder joint reliability
review
solder joint defects
electronic packaging
