摘要
采用直流磁控溅射方法在SiO2/Si衬底上制备出Pt/Ti和Pt/TiOx底电极。用XRD分析其晶相结构,用AFM测量其晶粒尺寸和表面粗糙度。结果表明,用TiOx层代替金属Ti后,能有效地抑制在高温环境下Ti原子向Pt层扩散,使电极表面粗糙度减小(粗糙度为2.99 nm)。
Pt/Ti and Pt/TiOx bottom electrodes were prepared on SiO2/Si substrate by DC-sputtering method. The X-ray measurements allowed us to get the crystal orientation and microstructure of the Pt electrodes. The size of grain and roughness of Pt/Ti or Pt/TiOx bottom electrodes caused by Ti out-diffusion before and after RTA treatment were observed by AFM. The results show that the roughness of Pt/Ti bottom electrode increases much higher and hillocks are formed after high temperature treatment, However, the surface of Pt/TiOx bottom electrode keeps quite flat (roughness is 2.99 nm).
出处
《电子元件与材料》
CAS
CSCD
北大核心
2006年第3期24-26,共3页
Electronic Components And Materials
基金
湖北省自然科学基金资助项目(2003ABA066)
关键词
电子技术
铁电薄膜
PT/TI电极
粗糙度
Ti扩散
electronic technology
ferroelectric tnin film
Pt/Ti electrode
roughness
Ti out-diffusion