便携式通讯终端中电触点磨损的研究

Investigation of Wear on Electrical Contacts in Portable Communication Terminals

分析了便携式通讯终端中PCB镀金电触点的表面磨损情况。连接器簧片与PCB触点之间相对运动造成的磨损加剧了污染,是造成接触失效的主要原因之一。磨损过程为先粘结再擦伤,最后镀金层被磨穿。磨损碎屑被逐渐推到磨损区端部与尘土、摩擦聚合物混合聚集在一起。触点表面磨损的主要方向和磨损区尺寸取决于触点的配合结构。研究结果为建立便携式通讯终端中镀金电触点失效模拟奠定了基础。

The wear on the gold plated contacts was analyzed between the spring terminals of connectors and printed circuit board （PCB） in failed portable communication terminals, The wear caused by the relative-motion between the spring and PCB contacts made contamination more worse, and this was one of the main reasons to result in the contact failure. The process of wear was from adhesive to abrasive, the gold plating was worn out at last. The wear debris was pushed to the ends of wear tracks mixed with dust particles and frictional polymer. The direction and amplitude of wear were decided by the mating structures of contacts. The investigation results are the foundation of failure simulation of electrical contacts in portable communication terminals.