球栅阵列(BGA)自动植球机的研制

Development of Ball Attachment Machine for BGA Semiconductor Packages

研究了一种低成本、高效率的BGA全自动植球机,该植球机通过计算机控制,一次性将所需的锡球拾取、摆放到BGA基板上,并能对植球情况进行图像检测。文中着重介绍了STAR-04Z全自动植球机的总体设计方案,研究了真空吸引法植球技术的原理和BGA全自动植球机的系统组成,并进行了原理样机的结构设计,提出了一种基于BGA全自动植球机图像检测和精确定位系统的体系结构。

A kind of full automatic ball attachment machine with low cost and high efficiency is studied. Under computer control, it can pick the needed balls, deposit the balls on the BGA baseboard once a time and check the planting situation through image detecting simultaneously. The overall plan of STAR-04Z fully automated ball attachment machine is introdiuced in particular. The principle of planting balls technology using vacuum sucking method and the constitution of the automated plating balls system are introduced. The structure of the prototype is designed. A kind of system is proposed, which is based on the image detecting and accurate locating for BGA fully automated planting machine.