摘要
用化学沉积技术制备了N i-B表面强化铜基材料,研究了表面涂层的显微组织、涂液的成分对镍硼沉积速率的影响及有关性能.结果表明,用化学沉积技术能在纯铜表面形成一层均匀、连续的镍硼硬化层,镍硼涂层的沉积速率由涂液中的N iC l2,KBH4,NaOH,稳定剂和H2NCH2CH2NH2的浓度控制,涂层是非晶态组织和少量过饱和镍固溶体的混合物,热处理后在涂层中析出N i2B和N i3B化合物,改善了铜的表面硬度和耐磨损性能,对铜的电阻率影响不大.
An electroless deposition technique is used in strengthening the surface of pure copper. The microstructure, the effect of chemical composition of the coating bath on Ni-B deposition rate and some properties of Ni-B coating are studied. It was found practicable to coat a uniform and continuous Ni-B hardening layer on copper surface by this technique. The coating rate is controlled mainly by the concentration of NiCl2, KBH4, NaOH, stabilizer and H2NCH2CH2 NH2. The phase structure of the Ni-B coating is a mixture of amorphous and supersaturated solid solution. Ni2B and Ni3B are formed in the Ni-B coating during heat treatment, and the microhardness and wear resistance of the coating are also improved, in addition, the Ni-B coating has a little effect on the specific resistance of the prepared copper alloys.
出处
《大连铁道学院学报》
2005年第4期62-65,共4页
Journal of Dalian Railway Institute
基金
辽宁省教育厅科学研究计划资助项目(20203324)
关键词
化学沉积
Ni—B涂层
涂液
纯铜
Electroless deposition
Ni-B coating
Coating bath
Pure copper
