摘要
Moiré inteferometry and FEA (finite element analysis) were used to evaluate the thermal deformation of two electronic packages, QFP (quad flat package) and MCM (multi chip module).Thermal loading was applied by cooling the packages from 100℃ to room temperature (25℃). Moiré fringes were obtained on the cross sections of the packages to clarify the effect of the CTE (coefficient of thermal expansion) mismatch of the micro components, such as silicon, metal and resin. In QFP, the effects of packaging resin and PCB (printed circuit board) on the thermal deformation were investigated. The effect of location of three silicon chips in MCM was also examined.
Moiré inteferometry and FEA （finite element analysis） were used to evaluate the thermal deformation of two electronic packages, QFP （quad flat package） and MCM （multi chip module）. Thermal loading was applied by cooling the packages from 100℃ to room temperature （25℃）. Moiré fringes were obtained on the cross sections of the packages to clarify the effect of the CTE （coefficient of thermal expansion） mismatch of the micro components, such as silicon, metal and resin. In QFP, the effects of packaging resin and PCB （printed circuit board） on the thermal deformation were investigated. The effect of location of three silicon chips in MCM was also examined.
出处
《实验力学》
CSCD
北大核心
2006年第1期11-19,共9页
Journal of Experimental Mechanics
基金
ThisresearchwassupportedbyagrantfromtheShoraiFoundationforScienceandTechnology.
关键词
数字分析
热形变
电子仪器组件
QFP
MCM
electronic package； Moiré interferometry； thermal deformation； displacement field； QFP；MCM； PCB； coefficient of thermal expansion； finite element analysis
