Cu-30Ni-20Cr纳米复合镀层的高温氧化行为

HIGH TEMPERATURE OXIDATION BEHAVIOR OF ELECTRODEPOSITED Cu-30Ni-20Cr NANOCOMPOSITE FILM

采用复合电沉积法制备出新型的Cu-30Ni-20Cr纳米复合镀层．该镀层的组织结构与常规Cu-Ni-Cr三元合金不同,是由Cu-Ni基固溶体(晶粒尺寸约为60 nm)和纳米Cr颗粒(平均尺寸约为28 nm)组成．与相同工艺条件下制备的 Cu-40Ni合金镀层相比,Cu-30Ni-20Cr纳米复合镀层在800℃空气中的氧化速率显著降低,这是由于它能迅速形成一层连续、致密的Cr2O3膜所致．对Cr颗粒在Cu-30Ni-20Cr纳米复合镀层的高温氧化过程中所起的作用进行了讨论．

A novel electrodeposited Cu-rich Cu-30Ni-20Cr nanocomposite film was fabricated on pure copper substrate by co-electrodeposition of Cu-Ni alloy base （mean grain size： 60 nm） with Cr nanoparticles （mean size： 28 nm） from a sodium citrate bath. Compared with electroplated Cu-40Ni alloy film prepared using the same bath, the Cu-30Ni-20Cr nanocomposite film exhibited an extremely low oxidation rate in air at 800℃, due to the fast formation of a continuous Cr2O3 scale. The effect of the Cr nanoparticles on the oxidation behavior of the Cu-Ni-Cr nanocomposite films was discussed in detail.