摘要
硅晶片是微电子工业的基本建筑模块。用于制备集成电路的硅晶片的尺寸在稳步增大，因为晶片越大，每一加工步骤中所产生的部件也就越多．当晶片的直径增加到300mm或者更大时，它们就会变得越来越容易损坏，而且在制造期间容易受到产生的应力的影响。
出处
《红外》
CAS
2006年第3期46-47,共2页
Infrared
同被引文献44
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10Ariana D. P., Lu R. F. Evaluation of internal defect and surface color of whole pickles using hyperspectral imaging. Journal of Food Engineering, 2010, 96:583-590.
二级引证文献7
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3胡淑荣,应光耀,胡玉莉,杨世海,杨美华.赭曲霉毒素A快速检测方法研究进展及其在中药中的应用前景[J].中国中药杂志,2017,42(11):2032-2037. 被引量：12
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