摘要
对焦磷酸盐体系、甘油-锌酸盐体系、柠檬酸盐体系、酒石酸盐体系以及HEDP体系等无氰仿金电镀体系的各工艺规范以及3种仿金镀层钝化工艺配方进行了介绍。对离子仿金电镀工艺的优点、常用仿金离子镀镀层的种类和性能进行了概括。指出了仿金镀层各种保护漆涂覆工艺存在的问题以及无氰仿金电镀工业今后的发展方向。
The process criteria of non-cyanide imitating gold electroplating including systems of pyrophosphate, glycerolzincate, citrate, tartrate and HEDP, and the passivation process formulae of three kinds of imitating gold electroplating were introduced. The advantages of ion imitating gold electroplating, process sorts and properties of common imitating ion plating deposits were summarized. The existing problems in painting technics of various protective lacquer for imitating gold plating deposit and development trends of non-cyanide imitating gold plating industry were presented.
出处
《电镀与涂饰》
CAS
CSCD
2006年第3期51-54,共4页
Electroplating & Finishing
关键词
无氰仿金电镀
HEDP电镀
工艺规范
配方
non-cyanide imitating gold electroplating
HEDP electroplating
process criteria
formula
