摘要
用电化学渗氢测试方法探讨了氯化物体系、硫酸盐-氯化物混合体系电沉积Zn-N i合金镀层过程中的渗氢行为。结果表明,氯化物体系比硫酸盐-氯化物混合体系渗氢电流小,用电镀过程中的氢覆盖率和镀层孔隙率对渗氢特点进行了解释。
Behavior of hydrogen permeation in Zn-Ni alloy electrodeposition from chloride and sulfate-chloride baths was investigated using an electrochemical hydrogen permeation test technique. The result indicated that current of hydrogen permeation from chloride bath was smaller than that from sulfate-chloride bath. The characteristics of hydrogen permeation were explained in terms of the hydrogen coverage and the porosity of deposits during the electrodeposition of Zn-Ni alloy.
出处
《电镀与精饰》
CAS
2006年第2期10-13,41,共5页
Plating & Finishing
关键词
ZN-NI合金
电镀
电化学渗氢
氢覆盖率
孔隙率
zinc-niekcl alloy
electroplating
electrochemical hydrogen permeation
hydrogen coyerage
porosity
