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Research on Crucial Manufacturing Process of Rigid-Flex PCB 被引量：2

Research on Crucial Manufacturing Process of Rigid-Flex PCB
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摘要 The main characteristics, applications, the emphases of manufacturing process are introduced, and the research of new product of rigid-flex Printed Circuit Board （PCB） is also described. In particular, the plasma desmear process, which is the crucial problems of manufacturing process, is discussed in detail. Samsung 4-layer rigid-flex PCB has been developed successfully, and the qualification rate reaches to 89.4%. The main characteristics, applications, the emphases of manufacturing process are introduced, and the research of new product of rigid-flex Printed Circuit Board （PCB） is also described. In particular, the plasma desmear process, which is the crucial problems of manufacturing process, is discussed in detail. Samsung 4-layer rigid-flex PCB has been developed successfully, and the qualification rate reaches to 89.4%.
作者 汪洋 何为 何波 龙海荣 刘美才 吴苏
机构地区 School of Microelectronics and Information Engineering Zhuhai Topsun Electric Technology Co. College of chemistry and Environment Protection Engineering
出处 《Journal of Electronic Science and Technology of China》 2006年第1期24-28,共5页 中国电子科技（英文版）
关键词 Printed Circuit Borad （PCB） rigid-flex PCB manufacturing process plasma desmear process Printed Circuit Borad （PCB） rigid-flex PCB manufacturing process plasma desmear process
分类号 TN41 [电子电信—微电子学与固体电子学]
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参考文献9

  • 1Keating J,Larmouth R.High Volume Applications of Commercial Rigid-Flex[]..1996
  • 2Joel Y.Fine-line flex circuitry/A glance into the future of flexible circuitry[].PC Fabrication Asia.1995
  • 3Maynard B,Irvine,Sheldahl,et al.Reliable plated though holes for rigid flex boards[].Electronic Packaging&Production.1988
  • 4Joseph F.Improving rigid-fex plated through hole reliability[].Circuit Tree.1997
  • 5McKenney D J.Cost-eEffective flex/high-volume multilayer flex and rigid-flex technology[].PC Fabrication.1995
  • 6King J.Rigid-flex boards/looking at a firm future[].FPC Fabrication.1996
  • 7Fjelstad J.Improving rigid-flex plated through hole reliability[].Circuit Tree.1997
  • 8Markstein H W.A manufacturing technology/improved fabrication technologies have made rigid-flex circuitry more reliable and affordable[].Electronic Packaging&Production.1996
  • 9Forman C.Advances in flex/rigid flex circuit prototyping technology[].IPC Printed Circuits.1995

同被引文献24

  • 1殷春喜.采用RCC与化学蚀刻法制作高密度互连印制板[J].印制电路信息,2003,11(2):44-46. 被引量：1
  • 2林金堵 梁志立 陈培良.现代印制电路先进技术[M].中国印制电路行业协会CPCA,印制电路信息杂志社PCI出版,2003.10..
  • 3Robert.H.TechSearch International Analyzes Market Surge in High Density Interconnect Flex Circuits.CircuiTree,2000,12:35～ 40
  • 4Happy Holden.The challenges in implementing HDI:How Value Will Be Delivered In Product Realization Circuitree,2001,1:95～99
  • 5Flexible Road Trip:Material Roadmap for High Density Flex Circuits.CircuiTree,2000,1:9～ 13
  • 6Prasad Nevrehar.Liquid Crystalline PoLymer:the Next Generation of High-performance Flex Circuit Material[J].Circutree,2002,4:46～54
  • 7Kazufumi Watanabe,Hiroki Fukatsu.Liquid crystalline polyester resin composition.hppt://www/freshpatents.com/Liquidcrystalline-polyester-resin-composition-dt20060202 ptan 20060025561.php? type= description.
  • 8Aoki,M,and H.Nobuyuki,Environment-friendly material.Circui Tree,1999,3:144～ 152
  • 9Gil White,Rajesh Kumar.Laser Drilling Micro Vias.IPC Printed Circuit Expo,New York,2002
  • 10Darryl McKenney,Arthur Demaso and Dominique Numakura,Microvia Technologies for High-Density Flex Circuit.Circui Tree,2000,4:30～36

引证文献2

二级引证文献19

Journal of Electronic Science and Technology of China
2006年 第1期

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