摘要
评述了智能功率技术最近的进展及市场动向。虽然目前的电力半导体芯片都是由硅制成的，但最近的分析表明，ＳｉＣ等其他的半导体材料也可能将来会代替硅。
This paper reviews recent progress and the market in smart power technology. Although, currently, power semiconductor chips are all made from silicon, recent analysis has indicated that other semiconductor materials, such as silicon carbide, have the potential for displacing silicon in the future.
出处
《半导体情报》
1996年第3期1-9,共9页
Semiconductor Information
