采用倒封装技术的硅热风速传感器封装的研究

Research on Silicon Thermal Flow Sensors with Flip-Chip Packaging

本文给出了一个采用倒封装技术实现的硅热风速传感器的封装结构。该传感器使用铜柱凸点技术,倒装于薄层陶瓷上。利用陶瓷的导热性能实现传感器芯片的加热元件和环境风速的热交换,同时陶瓷又起保护和支撑传感器芯片的作用。测试结果表明,封装后的传感器具有良好的性能。

A silicon thermal flow sensor by flip-chip technology is presented. The sensor chip is flip-chip packaged on a thin ceramic substrate using copper pillar bump technology. Heat transfer is performed between the polysilicon heater and the ceramic substrate. Meanwhile, the ceramic substrate holds the sensor chip and protects the chip from being contaminated or destroyed by the environment. The chip shows good performance after packaging.