摘要
利用SEM分析了纯镍电铸层,以及用直流和脉冲工艺所制备纳米复合电铸层的表面形貌,分别研究了影响直流和脉冲纳米复合电铸层显微硬度的各种因素,同时对纳米复合电铸层的强化机理进行了探讨。结果表明,纳米复合电铸层的表面形貌不同于纯镍电铸层,并且其显微硬度得到明显提高。纳米复合电铸层的强化机理主要是细晶强化机制、弥散强化机制和高密度位错强化机制。
The surface morphologies of purely electroformed Ni deposits and nano composite deposits electroformed under direct and pulse currents are analyzed by SEM. Various factors affecting the microhardness of nano composite deposits electroformed under direct and pulse currents are investigated, and its strengthening mechanism is also discussed. Results indicate that surface morphology of the nano composite electroformed deposits is different from that of purely electroformed Ni deposits, and the microhardness of nano composite electroformed deposits is markedly improved. The strengthening mechanism of nano composite electroformed deposits mainly involves fine-crystal, nanoparticle dispersion and dislocation effects.
出处
《电镀与环保》
CAS
CSCD
2006年第2期36-39,共4页
Electroplating & Pollution Control
关键词
复合电铸层
表面形貌
显微硬度
强化机理
nano composite electroforming deposits
surface morphology
mierohardness
strengthening mechanism