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Cu丝超声球焊及楔焊焊点可靠性及失效机理研究 被引量：7

Research Status of Reliability and Failure Mechanism of Ultrasonic Ball and Wedge Bonding With Copper Wire
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摘要 Cu丝由于具有优良的导热性能、机械性能以及低成本等优点使得用铜丝替代传统的Au丝和A l丝已经成为半导体工艺发展的必然方向。综述了Cu丝超声球焊以及楔焊焊点可靠性问题,对焊点的各种失效模式与机理进行探讨。 Copper wire bonding is an alternative interconnection technology promising cost savings compared to gold wire bonding and better electrical performance compared to aluminum wire, Reliabilityand failure mechanism of copper ball bonding and wedge bonding was reviewed and discussed.
作者 田艳红 杭春进 王春青
机构地区 哈尔滨工业大学现代焊接生产技术国家重点实验室
出处 《电子工艺技术》 2006年第2期63-69,共7页 Electronics Process Technology
关键词 铜丝球焊 楔焊 超声焊 Copper ball bonding Wedge bonding Thermosonic wire bonding
分类号 TG40 [金属学及工艺—焊接]
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参考文献19

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同被引文献50

  • 1陈新,李军辉,谭建平.芯片封装中铜线焊接性能分析[J].电子机械工程,2004,20(5):18-21. 被引量：4
  • 2徐慧,杭春进,王春青,田艳红.金、铜丝球键合焊点的可靠性对比研究[J].电子工业专用设备,2006,35(5):23-27. 被引量：14
  • 3田艳红,孔令超,王春青.芯片互连超声键合技术连接机制探讨[J].电子工艺技术,2007,28(1):1-5. 被引量：7
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引证文献7

二级引证文献25

电子工艺技术
2006年 第2期

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