摘要
Cu丝由于具有优良的导热性能、机械性能以及低成本等优点使得用铜丝替代传统的Au丝和A l丝已经成为半导体工艺发展的必然方向。综述了Cu丝超声球焊以及楔焊焊点可靠性问题,对焊点的各种失效模式与机理进行探讨。
Copper wire bonding is an alternative interconnection technology promising cost savings compared to gold wire bonding and better electrical performance compared to aluminum wire, Reliabilityand failure mechanism of copper ball bonding and wedge bonding was reviewed and discussed.
出处
《电子工艺技术》
2006年第2期63-69,共7页
Electronics Process Technology
关键词
铜丝球焊
楔焊
超声焊
Copper ball bonding
Wedge bonding
Thermosonic wire bonding