摘要
通过正交试验设计形成Sn-Ag-B i-Cu-In系无铅钎料合金,并对钎料合金的熔化温度、可焊性、密度及剪切强度等进行研究。研究发现,Sn-Ag-B i-Cu-In系钎料合金熔化温度接近传统的熔化温度,固-液温度差小;钎料密度约为传统Sn63Pb37的87%;试样铺展面积为72.02mm2,与Sn63Pb37焊锡的铺展面积76.85 mm2非常接近;钎料的剪切强度远大于传统Sn63Pb37钎料的剪切强度,其断裂形貌为沿晶脆断。
The composition of Sn - Ag - Bi - Cu - In lead - free solders were studied, through orthogonal design experiment method. In addition, melting temperature, solderahility density, shear strength wereanalyzed. The results show that, melting temperature of Sn - Ag - Bi - Cu - In lead - free solders andSn63Pb37solder are very close,and melting range is small. The density of solders are about 87percent oftraditional Sn63Pb37. The spread area of sample is 72.02 mm^2 ,approaching 76.85 mm^2 of the spread area of Sn63Pb37solder. The shear strength is higher than traditional Sn63Pb37. And the fracture surface ofsolder is around grain boundary.
出处
《电子工艺技术》
2006年第2期73-77,共5页
Electronics Process Technology
基金
云南省科技攻关项目[2002gg-ZB07]
