摘要
A novel flash memory cell with stacked structure （Si substrate/SiGe quantum dots/tunneling oxide/polySi floating gate） is proposed and demonstrated to achieve enhanced F-N tunneling for both programming and erasing. Simulation results indicate the new structure provides high speed and reliability. Experimental results show that the operation voltage can be as much as 4V less than that of conventional full F-N tunneling NAND memory cells. Memory cells with the proposed structure can achieve higher speed, lower voltage, and higher reliability.
提出了一种用于半导体闪速存储器单元的新的Si/Si Ge量子点/隧穿氧化层/多晶硅栅多层结构,该结构可以实现增强F-N隧穿的编程和擦除机制.模拟结果表明该结构具有高速和高可靠性的优点.测试结果表明该结构的工作电压比传统NAND结构的存储器单元降低了4V.采用该结构能够实现高速、低功耗和高可靠性的半导体闪速存储器.
基金
国家自然科学基金资助项目(批准号:69836020)~~
