摘要
In order to meet the electrical and thermal performance requirements of current high performance optoelectronics, two package types with dual-in-line package(DIP) and ball grid array(BGA) for optoelectronics are modeled and thermally simulated, their thermal characterizations are compared and discussed by using the temperature contours and the simulated heating characterization curves in free air and forced air ambient. The results show that BGA has superior inside and outside total performances, and has the promising future in the highly integrated optoelectronics.
In order to meet the electrical and thermal performance requirements of current high performance optoelectronics, two package types with dual-in-line package（DIP） and ball grid array（BGA） for optoelectronics are modeled and thermally simulated, their thermal characterizations are compared and discussed by using the temperature contours and the simulated heating characterization curves in free air and forced air ambient. The results show that BGA has superior inside and outside total performances, and has the promising future in the highly integrated optoelectronics.
基金
National Defense Foundation of China(51419020401 HK01)
