热塑性聚酰亚胺微电子薄膜的制备

Investigation of the thermoplastic polyimide microelectronic film

以微电子业所急需的聚酰亚胺薄膜为背景,采用一种热塑性聚酰亚胺树脂(TPI),实验测定了聚合物溶液特性、干燥工艺及热拉伸性能。在化学环化过程中聚合物溶液粘度随时间逐步增大;15 h后粘度和重均相对分子质量及分布趋于稳定。薄膜溶剂含量在干燥初期急剧下降,干燥速率随干燥温度升高而增大。TPI树脂表现出良好的热塑拉伸性能,当温度高于其玻璃化温度时,最大拉伸比随升温速率降低而增大,而随拉伸载荷增加呈现出先增后降。TPI薄膜经拉伸处理后其力学性能得到明显提高,综合性能与日本钟渊TP E薄膜相当。

For the increasing demand of polyimide films in microelectronics, a kind of thermoplastic polyimide wasprepared for the film and studied from three aspects of polymer solution, drying and heat stretching. The viscosity ofthe polymer solution was increased with increasing time during the chemical imidization, and after 15 hours the viscosity, the weight-average molecular weight and its distribution approached their stable states. The results of dryingexperiments indicated that the solvent percent of films decreased quickly at the beginning stage of drying, and thedrying rate was increased with the elevated temperatures. The thermoplastic polyimide showed good thermo-plasticity for heat stretching. As the stretching temperature was higher than the glass transition temperature of the film, thelargest stretching ratio was decreased with the increasing heating rates, and increased first with increasing stress,and then fell down. The mechanical properties of the thermoplastic polyimide film were remarkably improved bystretching, and its comprehensive properties were closed to those of TP-E film from Japanese Kaneca Corporation.