导热电子灌封硅橡胶的研究进展

Research on liquid thermal conductive encapsulated silicone rubber

概述了导热电子灌封硅橡胶的研究背景。综述了导热电子灌封硅橡胶的组成,提高导热电子灌封硅橡胶导热性的途径及灌封工艺,灌封中常见的问题及改进措施,灌封材料的性能要求等,对导热电子灌封硅橡胶未来的研究方向进行了展望。

The research background of the liquid thermal conductive encapsulated silicone rubber was summarized.It was introduced that the composition of the thermal conductive encapsulated silicone rubber,the approach of improving the heat conductivity of thermal conductive encapsulated silicone rubber and its encapsulation technology,the required performance of the pouring material,as well as the common problems and the improvement in the encapsulation.At last,the future of heat conductive silicone rubber was forecasted.