针布齿条的低温渗硼实验研究

Research of the Low-temp Boronizing Process of Card Wires

详细讨论了针布齿条氮基气氛外层保护低温渗硼的实验方法、设备及工艺流程。通过对渗硼剂、渗硼工艺及其渗硼层特点的分析,指出了采用该工艺渗硼可使针布齿条试样具有渗层致密均匀(层厚10μm)、齿部硬度高(1 290HV)、表面粗糙度值较低等优异的综合性能,且具有冲齿齿廓清晰,齿顶、齿棱、齿角锋利,齿部无卷刃和毛刺等特点。

Detailed introduction is given to the low-temp boronizing process of card wires with nitrogen based protection as well as the equipment and the working flow. Through the analysis of the boronizing agent, the boronizing process and the boronizing layer, conclusion is made that the boronized sample has excellent integrated performance such as compact homogeneity layer as thick as 10μm with rigidity of 1290 HV on the tip of the teeth plus good surface asperity. The boronized card wire has clear profiled teeth,sharp pointed ridge and corner. There are no turned or burred teeth.