摘要
借助分子动力学方法对薄膜成核的微观过程和基体形貌进行了模拟分析。当基体形貌的偏斜度Sk为负值时,接触角θ较小,成核率较高;随着Sk的降低,基体的形貌满型增多,沉积粒子参与成团的个数也随之增加,从而成核率也会增加,进而利于薄膜随后的长大、成膜。从理论上证明了不同的基体表面形貌对基体与所形成的薄膜之间的结合强度有很大影响,偏斜度Sk取值在-1^-3时,所生长的薄膜膜基间结合强度高。
On the ground of the molecuar dynamics, the process of film nucleation and the surface morphology of the substrate have been simulated and analyzed. If the Sk is negative, and 0 is smaller, the nucleation rate is higher in the simulation process of thin film nucleation. The lower the Sk is, the more the full morphology of substrates is, the more the number of nucleation is, and then the nucleation rate is higher and benefit for the growth of coating. The results of the simulation indicate that the different surface morphology of the substrates has been with the adhesive on strength of coating-substrate. It is proved that when the SkiS from - 1 to - 3, the adhesion strength of coating-substrate is higher.
出处
《表面技术》
EI
CAS
CSCD
2006年第2期13-14,26,共3页
Surface Technology
基金
北京市重点学科建设(XK100070424)
北京理工大学基金(0303E10)
关键词
偏斜度
分子动力学
计算机模拟
Skewness of the profile ( Sk )
Molecular dynamics
Computer simulation