摘要
详细介绍了双框架结构的硅微型机械振动陀螺的工作原理及工艺，设计并试制出了挠性轴厚度为０．８μｍ的三种不同尺寸的双框架结构的硅微型机械振动陀螺的样品，其机械结构的主要尺寸误差可控制在１０％以内。
The principle, processing of silicon micromechanical vibrating gyroscope with inner and outer frames are desired. These types of different size are designed. And trial-produced with the thickness is 0.8 μm of an axis with flexures. The error of structure size is controlled less than 10%.
出处
《传感器技术》
CSCD
1996年第5期17-19,26,共4页
Journal of Transducer Technology
关键词
硅
微机械
陀螺
工艺
Silicon
Micromechanical
Gyroscope
Processing
