梯度结构聚晶金刚石复合片残余热应力的有限元分析

Finite Element Analysis of Residual Thermal Stress in Functionally Graded Polycrystalline Diamond Compact

利用Ansys有限元分析软件,对梯度结构聚晶金刚石复合片在制造过程中产生的残余热应力进行了分析,并与传统的双层结构金刚石-硬质合金复合片的残余热应力进行了对比。结果表明,和双层结构复合片相比,梯度结构聚晶金刚石复合片的轴向拉应力由698 MPa降到了283 MPa,径向拉应力由1470 MPa降低到880 MPa,剪应力由653 MPa降到368 MPa,此外还改善了界面处的应力分布,大大提高了界面的结合强度。

Residual thermal stress of functionally graded polycrystalline diamond compact was analyzed by the finite element method with ANSYS software. It was showed that the axial tensile stress in functionally graded polycrystalline diamond compact was reduced from 698MPa to 283 MPa compared with two layer polycrystalline diamond compact, radial tensile stress was reduced from 1770 MPa to 880 MPa, and shear stress was reduced from 653 MPa reduced down to 368 MPa. In addition, the stress distribution is improved in the interface of functionally graded polycrystalline diamond compact, and bond strength are greatly increased.