间接加热式MEMS微波功率传感器的模拟与设计

Simulation and Study on Indirectly-heated MEMS Microwave Power Sensor

在提出间接加热终端式MEMS微波功率传感器的结构和工艺的基础上,对其基本单元:共面波导(CPW)、终端电阻和热电堆之间进行了匹配性设计,用软件HFSS进行了模拟,模拟结果包括共面波导与接触垫间的阻抗匹配的分析以及热电偶的数目和热电堆的接近对CPW性能影响的分析。根据这些模拟结果,传感器中接触垫与共面波导之间的渐进区长度设计为150μm,热电偶的对数设计为50对,热电堆与CPW之间的距离设计为50μm,并选择了GaAs和Au作为热电偶的两臂,TaN作终端电阻。

The indirectly-heated terminating type MEMS microwave power sensor＇s structure and process were presented, and based on these,the match design among the coplanar waveguide,the terminal resistors and the thermopile were done. Using HFSS,the simulation results were attained,including the matching between the pads and the CPW, the relation between the output of the thermopile and the number of the thermocouples, and the impact of approach of the thermopile on the CPW. Based on these simulation results, specify the dislance between the pads and the CPW is 150 μm, the number of the thermocouple is 50, the distance between the CPW and the thermopile is 50 μm. GaAs and Au are chosen as arms of the thennopile, and TaN as the terminal resistor.