摘要
对在现代无线通讯系统中应用的无源元件集成化的主要解决方案进行了介绍与分析,并对比了半导体薄膜集成技术与厚膜集成技术的主要优缺点,以研发的一种薄膜集成RCD低通滤波芯片为例,介绍了薄膜集成无源元件的设计方法和主要工艺流程。
The key solutions of passive elements integration for modern wireless communication system were introduced and analyzed. The main advantages ad shortcomings of integrating technologies for semiconductor thin and thick films were compared. An example of thin film integrated RCD low-pass filter was given, the design and process of the thin film integrated passive elements were introduced.
出处
《半导体技术》
CAS
CSCD
北大核心
2006年第4期241-244,共4页
Semiconductor Technology