ABS表面化学镀Cu／Ni－P的电磁屏蔽功能

Electromagnetic Shielding Effect of Electroless Copper/Nickel--Phosphorus on ABS Surface

在ＡＢＳ塑料表面以化学镀沉积ＣＵ／Ｎｉ－Ｐ双镀层，并探讨其与基体的结合强度、环境稳定性、导电性及电磁屏蔽性能；以ＳＥＭ观察了镀层的微结构及表观形貌．研究结果表明，ＡＢＳ／Ｃｕ／Ｎｉ－Ｐ材料具有较高的电磁屏蔽效率，且经久耐用．

The present paper deals with deposition of the bilayer on ABS surface by means of electroless and the attaching intensity with the substrate (ABS), environmental stability, conductivity, and electromagnetic shielding effect of electroless Cu/Ni--P bilayer on ABS surface in detail. The microstructure and the apparent morphology of the bilayer on ABS plastic surface were obserred bymeans of SEM. The results showed that ABS/Cu/Ni--P bilayer possesses a high electromagnetic shielding effect and is durable.