摘要
将多芯片LED与恒流源电路进行一体化混合集成电路工艺设计,保证了3~10W的多芯片集成LED在低于100mA的驱动电流下正常工作.恒流源采用跟随浮压技术进行设计,使集成LED的工作电压在2~200V,恒定工作电流在10~100mA选择.其恒流温度漂移小于5μA/℃,发光效率大于17Lm/W,同时简化了工频驱动电源电路的设计,减少远距离供电线路损耗.
It's designed by the hybrid microcircuit processing, with gather the more LED chips and constant current diode IC circuit proceeds the integral on the Si - substrate, guaranteed the 3 - 10 W integrated LED at lower than 100 mA drive current that is operation in long time. The constant current diode IC are by the f^oat voltage technique proceeding designed, insure the operating in long time of high power LED with the voltage between 2 V and 200 V and drive current at 10 - 100 mA. The constant current drift is than smaller 5 μA/℃ at the tempurature. Light efficiency is than more 17 Lm/W. Thin, supply power circuit is by simplied, with long- distance leave the power supply circuit exhaust.
出处
《福州大学学报(自然科学版)》
CAS
CSCD
北大核心
2006年第2期229-231,共3页
Journal of Fuzhou University(Natural Science Edition)
基金
科技部科技攻关资助项目(2003BA316A02-01-04)
关键词
多芯片LED
恒流
热阻
热沉
硅基板
more LED chips
constant current
heat resistance
heat - sink slug
Si - substrate