大介电常数覆铜箔铜基复合微波介质基板的研制

Developped of High Dielectric Constant and Copper-clad Copper Base Composite Microwave Dielectric Substrate

通过对可调节介电常数的填充材料、介质厚度均匀性、铜板处理工艺的研究与选择,研制开发出了介电常数为6.15、介质损耗因数为0.0015的铜基高频电路用覆铜板。

By studying the filling which can adjust dielectric constant, the equality of dielectric thickness and copper board preparation technics, have developped high frequency circuit using copper-clad copper base board whose dielectric constant is 6.15 and dissipation factor is 0,0015.