摘要
概述了利用金属蚀刻凸块的散热构造PCB的开发,可以满足小型情报终端和模组元件基板等的散热性和高密度布线的需要。
This paper describes the development of heat Sink constilulion PCB using metal etching bump.It Can meet the needs of heat sink and high density wining for mininal information terminal and module component substrate etc.
出处
《印制电路信息》
2006年第4期52-55,59,共5页
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