BGA器件的筛网印刷考虑

Screen Printing for BGA Component

新一代的SMT器件都给工程师们和管理人员带来了材料涂布方面的挑战,BGA器件也不能例外。目前所开发的技术已经能够满足以高速度、高精度和高可靠性来进行焊膏的筛网印刷涂布操作。

Each new generation of SMT device adds to the material deposition challenges facing packaging engineers and managers, and BGAs are certainly no exception. Technologies are now available for the stencil printing deposition of solder pastes with greater speed, precision and repeatability.