集成电路用引线框架材料的研究现状与趋势

The Research Status and Trends of Lead Frame Materials for Integrated Circuits

作为集成电路中关键的一个组成部分,近年来引线框架得到了极大发展。概述了目前集成电路用引线框架材料的一些研究进展,包括引线框架的功能、制备工艺、成分设计及其对材料的性能要求等,重点介绍了铜基引线框架材料的特性和研发动态,最后,提出了今后引线框架材料的研究方向。

As a key part of integrated circuit, the lead frame has been greatly developed in recent years. The current status of research on lead frame materials used in integrated circuit is summarized in this paper. The function, production process, element design and the requirements to material performance of lead frame are reviewed. The feature and research trends of copper-based lead frame materials are stressly introduced. Finally, the research trends of lead frame material are estimated.