摘要
热感性型形状记忆高分子材料(thermostimulative shape memory polymer,TSMP)不仅具有形变量大、赋形容易,形状回复温度便于调节、加工方便等特点,而且种类丰富。按其固定相结构的不同,可分为热塑性TSMP和热固性TSMP。本文从表征方法、记忆机理等方面简述了热感应型形状记忆高分子材料最新的发展,其中重点阐述了近期热感应型形状记忆可降解高分子的形状记忆原理及其应用。
Thermostimulative Shape Memory Polymer Materials have the advantages of large deformation, light mass, rich variety, good processability, convenient to deform and easy regulate shape memory temperature. This article reviews the progress of TSMP based on the characterization and mechanics of shape memory and highlights mechanism and application of the biodegradable shape memory polymer.
出处
《高分子通报》
CAS
CSCD
2006年第4期70-75,92,共7页
Polymer Bulletin
基金
国家自然科学基金(20444001)
关键词
功能高分子材料
热感应
形状记忆材料
Functional materials
Thermostimulative
Shape memory polymer
