氧化铜-磷酸盐无机胶粘剂的制备工艺研究

Study on the Preparation Technics of Copper Oxide-Phosphate Inorganic Adhesive

研究了氧化铜粉粒径、磷酸盐密度、调胶比、固化时间及固化温度等对氧化铜-磷酸盐无机胶粘剂粘接性能的影响。实验结果表明，采用粒径为55～65μm的氧化铜粉，适当提高磷酸的聚合程度，调胶比R=4～5．5g／ml时，胶粘剂可以获得良好粘接性能。同时采用80℃左右的固化温度，保持不小于3h的固化时间，则是胶粘剂发挥最佳效能的决定性因素。同时添加合适的改性剂如氢氧化铝能够有效地改善胶粘剂粘接性能。

In this paper, the author researches the influence factors of gluing performance of copper oxide-phosphate adhesive. These factors including particle size of the copper oxide powder, density of phosphate, the rate of stirring （R = the quality of copper oxide powder compare to the volume of phosphate）, the curing time and the curing temperature, etc. According to the conditional experiment, we can get some conclusions as follow. Selecting copper oxide powder with proper particle size, raising the density of phosphate as far as possible, and adopting a proper value of R（R =4 ～5 g/ml） are key factors to the adhesive, which can obtain superior gluing performance. Using the reasonable conditions of curing is a decisive factor that the adhesive can performance permanently. And adding certain modifier is another method that improve the gluing performance.