摘要
集成电路存在的多余物可以分为可动和不可动两个类别,揭示了多余物产生的来源以及确定多余物存在的3种方法。介绍了塑封、陶封、玻璃熔装电路的封装结构以及如何采用开盖法、开洞灌封法、中间开孔法这3种捕捉多余物的方法,并对各种方法的适用范围和使用的特点进行了分析。以陶封电路为例,演示了用中间开孔法捕获可动多余物的过程。
The unwanted materials can be divided into two types, the mobiles and the immobiles. The source of unwanted materials and the methods to determine their existance are presented. Based on the architectwres of plastic, ceramic and glass package circuits, three methods for catching the unwanted materials are discussed with their appliable areas and features. One of the catching methods is illustrated with an example of ceramic circuit.
出处
《电子产品可靠性与环境试验》
2006年第2期41-44,共4页
Electronic Product Reliability and Environmental Testing
关键词
集成电路
封装
多余物
捕捉
IC
package
unwanted material
catching
